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Processor Module and Device Adapter Specification
6.0
DEVICE ADAPTER TARGET
6.2
TQFP/PLCC Device Footprints
FOOTPRINTS
To connect an emulator device adapter directly to a
target board (without the use of transition sockets) the
following information will be helpful.
TQFP/PLCC device adapter footprints shown will
accept board stackers like Samtec series DWM 0.050
Pitch Stackers. These stackers can be soldered in
place during development/emulation and eliminate the
need for any other sockets.
6.1
DIP Device Footprints
DIP device adapter footprints shown will accept
adapter plugs like Samtec series APA plugs. These
plugs can be soldered in place during development/
emulation and eliminate the need for any other sockets.
FIGURE 6-2:
DAF DRAWING – SINGLE-
ROW TQFP/PLCC
B
FIGURE 6-1:
A
x
DAF DRAWING – DIP
B
x
x
A
x
y
28
18
x = TQFP Pin 1 location
y = PLCC Pin 1 location
40
See Table 6-2 for A & B dimensions.
x = Pin 1 location
0.028 DIA
See Table 6-1 for A & B dimensions.
PLATED-THRU
HOLES
0.100
0.028 DIA
PLATED-THRU
HOLES
C
0.800
0.050
0.800
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
DIP
18 Pin
28 Pin
40 Pin
C
0.300
0.300
0.600
IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
TABLE 6-2:
DAF DIMENSIONS – TQFP/
PLCC
Drawing of DIP is 40 pin.
Package
44P TQFP/PLCC
44P TQFP/PLCC
DAF Number*
DAF18-3
DAF18-5
A
2.600
2.600
B
2.950
3.100
TABLE 6-1:
DAF DIMENSIONS – DIP
44P TQFP/PLCC
DAF30-3
2.600
2.950
Package
18/28/40P DIP
18/28/40P DIP
18/28/40P DIP
DAF Number*
DAF18-2
DAF18-4
DAF30-4
A
2.600
2.600
2.600
B
2.950
3.100
3.300
* See the MPLAB ICE 4000 Readme file for informa-
tion on devices supported by each DAF.
* See the MPLAB ICE 4000 Readme file for informa-
tion on devices supported by each DAF.
? 2005 Microchip Technology Inc.
Preliminary
DS51298E-page 5
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